Category
AMCF100750
Features
Customizable Solutions Available.
Utilize PCB layout with Rectangular form factor.
Low magnetostriction(acoustics improve).
Sinter(750 degree process) prevent heat ageing.
Ultra-High efficiency with ultra-low RDC.
Low inductance & High Saturation.
High efficiency and high power density is realized with optimized powder system.
Part Number | L (mm) | W (mm) | T (mm) |
AMCF100750GDR10MVB | 11.2 ± 0.5 | 7.2 ± 0.2 | 5.0MAX. |
P/N | L0(µH) @ (0A) 1MHz | Rdc(mΩ) | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| AMCF100750GDR10MVB | 0.1 | 0.3 | 0.33 | 67 | 60 | 50 | 45 |
NOTE:
- OCL:Open Circuit Inductance.
- FLL:Full Load Inductance.
- Electrical specifications:at 20~25℃.
- Operation Temperature:-55~+165℃ (Including self-temperature rise).
- The part temperature (ambient + temp rise) should not exceed 165℃ under the worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provision all affect the part temperature. Part temperature should be verified in the end application.
- Storage Condition：+25℃±10℃,Humidity 40~70% RH.
- Test Instrument：LCR METER(Chroma3250,Test1790)，BIAS CURRENT SOURCE(Chroma1320,Chroma1320S),Chroma19053.
- Isat:For Inductance drop approximately 30% from its value without current.
- Irms：Typical Heat Rating D.C current would cause an approximately △T of 40℃(Ta=25℃).